基于熱軋流程下Cu-Ni-Si合金組織和性能演變規律

基于熱軋流程下Cu-Ni-Si合金組織和性能演變規律Evolution of structure and property for Cu-Ni-Si alloy based on hot-rolling process

利用掃描電鏡、透射電鏡、金相顯微鏡及顯微硬度儀等研究了Cu-Ni-Si合金在鑄態、熱軋態、固溶態、冷軋和時效態的顯微組織、晶粒取向及大小和析出相的演變過程，分析熱軋流程中各類組織及工藝狀態對合金性能的影響規律。結果表明：合金成分是影響枝晶偏析和再結晶程度的關鍵，熱軋后晶粒擇優取向明顯，發生部分再結晶，晶格畸變程度增大，導電率明顯下降；隨著固溶溫度的升高和固溶時間的延長，合金抗拉強度、硬度和導電率均呈下降趨勢，合金經900 ℃、1 h處理后達到最佳固溶效果， 晶界達到35.2%，大角晶界達到了64.4%，晶粒取向均勻；冷軋后，晶粒被拉長、撕碎，基體產生大量缺陷，為時效析出提供核心作用；冷軋變形量越大，時效析出動力越強，析出相越細小、均勻，綜合性能越好；合金在經450 ℃、3 h處理后達到最佳時效效果，硬度為259HV，導電率為36.5%IACS。

Using SEM, TEM, OM and microhardness tester, the evolution of microstructure, grain orientation, size and precipitated phase of Cu-Ni-Si alloys in hot-rolling process during casting, hot rolling, solid solution, cold rolling and aging were studied. Meanwhile, the effect of microstructure and process state on properties were analyzed. The results show that the key to influence the degree of dendrite segregation and recrystallization is alloy composition. After hot rolling, the preferential orientation of the grain is obvious, and some recrystallization will occur. Meantime, due to the degree of lattice distortion increase, the conductivity decreases obviously. With the increase of solution temperature and the prolongation of time, the tensile strength, microhardness and conductivity of Cu-3.2Ni-0.75Si alloy decrease. The best solution effect is achieved at 900 ℃, 1 h, while the grain boundary reaches 35.2% and the large angle grain boundary reaches 64.4%, and the grain orientation is uniform. After cold rolling, the grains are torn, elongated, and the matrix produces a large number of defects, which provide the core for aging precipitation. The larger for rolling reduction, the stronger the precipitation force, and the finer the precipitated phase, of course, the better the comprehensive performance. The alloy has the best aging effect at 450 ℃, 3 h, with hardness of 259HV, and electrical conductivity of 36.5% IACS.

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